Liquid cooling of non-uniform heat flux of a chip circuit by subchannels

High Heat Flux Cooling by Liquid Jet-Array Modules

Heat removal at high power density is a continually challenging problem. Traditionally, the highest heat fluxes have been removed by flow boiling systems, for which critical heat flux is the usual limiting factor. Indeed, the highest steady-state heat fluxes obtained have generally been CHF values for tube flows of water, with maximum critical fluxes in the range of 100 to 350 MW/m. These heat ...

Chip integrated micro cooling system for high heat flux electronic cooling applications

Rapid development in VLSI Technology anticipates an urgent need for new micro cooling strategies for high heat flux electronic chips. This paper presents a novel high efficiency micropump/evaporator, based on electrohydrodynamic (EHD) forces, high heat flux electronic sensors. The device incorporates a MEMS-based active micro-evaporative surface and temperature sensors into a single package tha...

Experimental and Numerical Study of Transient Electronic Chip Cooling by Liquid Flow in Microchannel Heat Sinks

Cooling of electronic chips has become a critical aspect in the development of electronic devices. Overheating may cause the malfunction or damage of electronics. The time needed for heat removal is particularly important in a wide range of electronic systems, such as switching circuits. Thus, it is important to characterize the transient behavior of the system and determine the response. Most ...

Turbulent Mixed Convection of a Nanofluid in a Horizontal Circular Tube with Non-Uniform Wall Heat Flux Using a Two-Phase Approach

In this paper, Turbulent mixed convective heat transfer of water and Al2O3 nanofluid has been numerically studied in a horizontal tube under non-uniform heat flux on the upper wall and insulation in the lower wall using mixture model. For the discretization of governing equations, the second-order upstream difference scheme and finite volume method were used. The coupling of pressure and veloci...

Development of an On-Chip Cooling Device for High-Heat-Flux Microprocessors